By Claus Hetting, WiFi NOW CEO & Chairman
Sydney, Australia and Irvine, California-based Morse Micro has secured US$59 million in Series C funding taking their total funding to an impressive US$193 million to date. The Wi-Fi HaLow silicon leader says the new financing is an important step towards realising its mission to become the world’s number one wireless IoT chip company. Morse Micro this week also announced general availability of second generation MM8108 HaLow SoC while the HalowLink 2 reference design will be available in Q1 2026.
Morse Micro continues to create exceptional momentum for adoption of the Wi-Fi HaLow IoT standard – and now the company is being rewarded for its outstanding results and the strength of its vision. This week Morse Micro announced the results of its Series C funding round: More than ten separate organisations have teamed up to provide Morse Micro with an additional US$59 million in funding. The Series C round was once again led by Japanese fabless silicon company MegaChips.
“The results of our financing round is truly a validation of all the great work we’ve been doing and our excellent results so far. It is also proof that our vision for a Wi-Fi HaLow connected future is holding up very nicely. Finally, it is a vote of confidence from our existing investors as it is nearly the same group coming back to support us again. We’re incredibly grateful to our investors and their trust in us,” says Michael De Nil, CEO of Morse Micro.
The new financing will secure the continuation of Morse Micro’s global expansion as well as further investments into Wi-Fi HaLow silicon technology, including third to fifth generation Wi-Fi HaLow SoCs. “We want to double down on our expansion into Europe and Japan and continue to make inroads into North America and elsewhere in Asia. Even though spectrum availability is less for example in Europe, Wi-Fi HaLow will still do an excellent job for the critical IoT connectivity use cases,” he says.
Also this week Morse Micro announced general availability of the second generation MM8108 Wi-Fi HaLow Soc, which delivers up to 43 Mbps of throughput using 256 QAM modulation and MCS9 coding. Above all Morse Micro is now positioning Wi-Fi HaLow SoCs as enablers of the transition to IoT 2.0 defined as ‘a new phase characterised by high-throughput, long-range, and highly scalable connectivity for IoT devices’. Morse Micro’s HalowLink 2 evaluation platform (reference design) device was also announced this week featuring as much as 50% improved range due to a new and integrated 26 dBm PA.
Michael De Nil says that while the North American market at the moment is mostly focused on IP cameras as the main Wi-Fi HaLow use case, Japan is increasingly embracing Wi-Fi HaLow for a wider set of applications including many within industry. “Japan – including the Japanese government – has been a big proponent of HaLow since the early days and today Wi-Fi HaLow is being used for factory automation, residential applications such as wireless door locks, as well as HVAC sensors and even robotics. We will no doubt see such use cases expand across the world in due time,” he says.
Morse Micro Wi-Fi HaLow technology is already widely available in module form for fast integration into new devices. All of Vantron, Quectel, and AzureWave today offer Wi-Fi HaLow modules based on Morse Micro SoCs. For more on Wi-Fi HaLow also see our monthly Wi-Fi HaLow report here and remember to register for our our October 14 Wi-Fi HaLow industry update webinar featuring Morse Micro here.
/Claus.
